Increase productivity at wafer test using probe retest data analysis

A method for testing integrated circuit devices after manufacture, said method comprising:

• testing an initial group of devices to produce an initial failing group of devices that failed said testing of said initial group, wherein said devices in said initial failing group are identified by type of failure;
• retesting said devices in said initial failing group to identify a retested passing group of devices that passed said retesting;
• analyzing said devices in said retested passing group to produce statistics regarding the likelihood that a failing device will pass said retesting according to said type of failure;
• evaluating said statistics to determine which types of failures have retest passing rates above a predetermined threshold to produce a listing of types of defects approved for retesting;
• testing an additional group of devices that is different from, said initial group of devices to produce an additional failing group of devices that failed said testing of said additional group;
• identifying types of devices having a predetermined reduced demand;
• and
• retesting only devices in said additional failing group that have one of said types of defects approved for retesting and that are not said types of devices for which there is said predetermined reduced demand.

A system for testing integrated circuit devices after manufacture, said system comprising:

• means for testing an initial group of devices to produce an initial failing group of devices, wherein said devices in said initial failing group are identified by type of failure;
• means for retesting said devices in said initial failing group to identify a retested passing group of devices;
• means for analyzing said devices in said retested passing group to produce statistics regarding the likelihood that a failing device will pass said retesting according to said type of failure;
• means for evaluating said statistics to determine which types of failures have retest passing rates above a predetermined threshold to produce a listing of types of defects approved for retesting;
• means for testing an additional group of devices that is different from said initial group of devices to produce an additional failing group of devices;
• and
• means for retesting only devices in said additional failing group that have one of said types of defects approved for retesting.