Reworkable thermal interface material

A computing system comprising:

• a die;
• a first heat sink;
• a thermal interface material disposed between the die and the first heat sink, the thermal interface material including:
• a matrix, wherein the matrix exhibits a phase change between about 30° C. and about 100° C.;
• and
• a distribution of first interstitial heat transfer structures in the matrix, including a size range from about 5 micron to about 25 micron, and wherein the distribution of first interstitial heat transfer structures occupies from about 5 volume percent to about 95 volume percent of the composition;
• wherein the die is separated from the first heat sink by less than or equal to about 30 micron;
• a second heat sink disposed above the first heat sink;
• and
• a thermal interface material disposed between the first heat sink and the second heat sink, including:
• a second heat sink matrix, wherein the second heat sink matrix exhibits a phase change between about 30° C. and about 100° C.;
• and
• a distribution of first interstitial heat transfer structures in the second heat sink matrix, including a size range from about 5 micron to about 1,000 micron, and wherein the distribution of first interstitial heat transfer structures occupies from about 5 volume percent to about 95 volume percent of the composition;
• and a data storage system coupled to the die.

An article comprising:

• a die;
• a first heat sink;
• and
• a thermal interface material disposed between the die and fir first heat sink, the thermal interface material including:
• a matrix including a first surface and a second surface that is parallel planar to the first surface, wherein the matrix exhibits a phase change between about 30° C. and about 100° C., and wherein the first surface is separated from the second surface by less than or equal to about 30 micron;
• and
• a distribution of contiguous first interstitial heat transfer structures exhibiting a contiguous interstitial heat transfer structure path in the matrix, including a size range from about 5 micron to about 25 micron, and wherein the distribution of first interstitial heat transfer structures occupies from about 5 volume percent to about 95 volume percent of the composition;
• a second heat sink disposed above the first heat sink;
• a thermal interface material disposed between the first heat sink and the second heat sink, including:
• a second heat sink matrix, wherein the second heat sink matrix exhibits a phase change between about 30° C. and about 100° C.;
• and
• a distribution of first interstitial heat transfer structures in the second heat sink matrix, including a size range from about 5 micron to about 1,000 micron, and wherein the distribution of first interstitial heat transfer structures occupies from about 5 volume percent to about 95 volume percent of the composition.