CSP semiconductor device having signal and radiation bump groups
AssigneeOki Electric Industry Co., Ltd.
InventorsHideaki Yoshida, Tae Yamane
Life of this patent
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Abstract
A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a conductive film which is formed on the insulating film and the pad, a sealing material which covers a part of the conductive film and the insulating film and a bump which is formed over the conductive film, wherein the bump is exposed from a surface of the sealing material.
Claims16
A CSP type semiconductor device, comprising:
- a semiconductor chip having a main surface on which a circuit is formed and a back surface opposite to the main surface, wherein the back surface has a first edge, a second edge opposite the first edge, and a plurality of grooves extending from the first edge to the second edge;
- a pad which is formed on the main surface of the semiconductor chip;
- an oxide film which is formed on the main surface of the semiconductor chip, wherein the oxide film has a main surface and a back surface facing to the main surface of the semiconductor chip;
- an insulating film which is formed on the main surface of the oxide film and a part of the pad;
- a conductive film which is formed on the insulating film and the pad;
- a sealing material which covers the insulating film and a part of conductive film;
- and
- a first bump which is formed over the insulating film, wherein the first bump is exposed from the sealing material.
A semiconductor device, comprising:
- a semiconductor chip having a main surface on which a circuit is formed and a back surface opposite to the main surface, wherein the back surface has a first edge, a second edge opposite the first edge, and a plurality of grooves extending from the first edge to the second edge;
- a pad which is formed on the main surface of the semiconductor chip;
- and
- an oxide film which is formed on the main surface of the semiconductor chip.
Dependencies are inferred from the claim text.