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US 7,253,517 B2Granted
Method and apparatus for combining multiple integrated circuits
AssigneeRaytheon Company
InventorJohn G. Heston
Life of this patent
Estimating the term…
Abstract
An apparatus includes a circuit having first, second and third circuit portions, the first and third circuit portions each including at least one semiconductor circuit component. The second circuit portion includes at least one non-semiconductor circuit component, and is free of semiconductor circuit components. A first substrate has the first and second circuit portions disposed adjacent one side thereof. A second substrate is physically separate from the first substrate, and has the third circuit portion disposed adjacent a side thereof which faces the one side of the first substrate. The second and third circuit portions have electrically conductive parts which are coupled by thermo-formed bonds.
Claims22
An apparatus comprising:
- a circuit having first, second and third circuit portions, said first circuit portion including at least one semiconductor component and said third circuit portions including at least one semiconductor circuit component, and said second circuit portion including at least one non-semiconductor circuit component and being free of semiconductor circuit components, said second circuit portion having first and second electrically conductive parts, and said third circuit portion having third and fourth electrically conductive parts which are respectively coupled to said first and second electrically conductive parts by a thermosonic bond and a thermocompression bond such that said first and second electrically conductive parts rigidly support said first circuit component adjacent said third circuit component;
- a first substrate with said first and second circuit portions disposed adjacent one side thereof, said first substrate having a semiconductor portion which has each said semiconductor circuit component of said first circuit portion therein;
- a second substrate with said third circuit portion disposed adjacent one side thereof, said second substrate being physically separate from said first substrate and being oriented so that said one side thereof faces said one side of said first substrate, and said second substrate having a semiconductor portion which has said at least one semiconductor circuit component of said third circuit portion therein and said second substrate being devoid of any other semiconductor circuit component;
- and
- wherein the second substrate and the second circuit portion have no electrical connection therebetween other than any electrical connection formed between the first and second electrically conductive parts of the second circuit portion and the third and fourth electrically conductive parts of the third circuit portion.
2 more elements
A method comprising:
- providing a first substrate which has a semiconductor portion;
- forming first and second circuit portions adjacent one side of said first substrate, said first circuit portion including at least one semiconductor circuit component, and said second circuit portion including at least one non-semiconductor circuit component and being free of semiconductor circuit components, said second circuit portion having first and second electrically conductive parts, and said semiconductor portion of said first substrate having therein each said semiconductor circuit component of said first circuit portion;
- providing a second substrate which is physically separate from said first substrate and which has a semiconductor portion;
- forming a third circuit portion adjacent one side of said second substrate, said third circuit portion including at least one semiconductor circuit component, said third circuit portion having third and fourth electrically conductive parts, and said semiconductor portion of said second substrate having therein each said semiconductor circuit component of said third circuit portion;
- orienting said second substrate relative to said first substrate so that said one side thereof faces said one side of said first substrate and said first and second electrically conductive parts are respectively engaging said third and fourth electrically conductive parts, said first and second electrically conductive parts rigidly supporting said first circuit component adjacent said third circuit component;
- creating a thermosonic bond and a thermocompression bond between said first and third electrically conductive parts and a thermosonic bond and a thermocompression bond between said second and fourth electrically conductive parts, said first, second and third circuit portions being respective portions of a single circuit;
- wherein said second substrate is devoid of any semiconductor circuit component other than said at least one semiconductor circuit component of said third circuit portion;
- and
- wherein the second substrate and the second circuit portion have no electrical connection there between other than any electrical connection found between the first and second electrically conductive parts of the second circuit portion and the third and fourth electrically conductive parts of the third circuit portion.
6 more elements
Dependencies are inferred from the claim text.