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US 7,253,516 B2Granted
Electronic device and carrier substrate for same
AssigneeNXP B.V.
InventorMartinus Jacobus Coenen
Life of this patent
Estimating the term…
Abstract
Consistent with an example embodiment, an electronic device comprises an integrated circuit and a carrier substrate with a bottom and top conductive layer, and is provided with voltage supply, ground and signal transmission connections. In order to enable the use of more than one supply voltage, the integrated circuit is subdivided into core functionality and peripheral functionality, and the carrier substrate is subdivided into a corresponding core area and peripheral area. The ground connections of both core and periphery are mutually coupled through an interconnect in the carrier substrate. This interconnect is particularly a ground plane, and allows the provision of a transmission line character to the interconnects for signal transmission of the periphery.
Claims8
An electronic device comprising:
- at least one semiconductor device provided, on a side, with a plurality of bond pads;
- and
- a carrier substrate comprising a layer of electrically insulating material and having a first side and an opposed second side, the first side and the opposed second side are each provided with an electrically conductive layer, on which first side bond pads are present which are suitable for coupling to the bond pads of the at least one semiconductor device, and on which second side contact pads for external coupling are provided, the contact pads and the bond pads being electrically interconnected according to a desired pattern, a first portion of the contact pads being defined for ground connection, a second portion of the contact pads being defined for voltage supply connection and a third portion of the contact pads being defined for signal transmission, in said electronic device
- the at least one semiconductor device is provided with core functionality and peripheral functionality, the core functionality and the peripheral functionality each being provided with voltage supply connection and ground connection,
- the carrier substrate is laterally subdivided into a core area and a peripheral area, in which core area the contact pads for the core functionality are provided and in which peripheral area the contact pads for the peripheral functionality are provided, wherein
- the carrier substrate comprises at least one interconnect for interconnecting the ground connections of the peripheral functionality and the core functionality, and
- means for decoupling the voltage supply of core and peripheral functionality to the common around are present,
- wherein the means for decoupling comprise a decoupling capacitor in the peripheral functionality, which is located either in the at least one semiconductor device or at the carrier substrate.
5 more elements
An electronic device comprising:
- at least one semiconductor device provided, on a side, with a plurality of bond pads;
- and
- a carrier substrate comprising a layer of electrically insulating material and having a first side and an opposed second side, the first side and the opposed second side are each provided with an electrically conductive layer, on which first side bond pads are present which are suitable for coupling to the bond pads of the at least one semiconductor device, and on which second side contact pads for external coupling are provided, the contact pads and the bond pads being electrically interconnected according to a desired pattern, a first portion of the contact pads being defined for ground connection, a second portion of the contact pads being defined for voltage supply connection and a third portion of the contact pads being defined for signal transmission, in said electronic device
- the at least one semiconductor device is provided with core functionality and peripheral functionality, the core functionality and the peripheral functionality each being provided with voltage supply connection and ground connection,
- the carrier substrate is laterally subdivided into a core area and a peripheral area, in which core area the contact pads for the core functionality are provided and in which peripheral area the contact pads for the peripheral functionality are provided, wherein
- the carrier substrate comprises at least one interconnect for interconnecting the ground connections of the peripheral functionality and the core functionality, and
- means for decoupling the voltage supply of core and peripheral functionality to the common ground are present,
- wherein the semiconductor device is placed on the carrier substrate in a flip chip orientation, the bond pads at the semiconductor device and on the first side of the carrier substrate being positioned in a corresponding configuration, and wherein a heat spreading layer is provided on the first side of the carrier substrate and on a side of the semiconductor device facing away from the side of the bond pads.
5 more elements
An electronic device comprising:
- at least one semiconductor device provided, on a side, with a plurality of bond pads;
- and
- a carrier substrate comprising a layer of electrically insulating material and having a first side and an opposed second side, the first side and the opposed second side are each provided with an electrically conductive layer, on which first side bond pads are present which are suitable for coupling to the bond pads of the at least one semiconductor device, and on which second side contact pads for external coupling are provided, the contact pads and the bond pads being electrically interconnected according to a desired pattern, a first portion of the contact pads being defined for ground connection, a second portion of the contact pads being defined for voltage supply connection and a third portion of the contact pads being defined for signal transmission, in said electronic device
- the at least one semiconductor device is provided with core functionality and peripheral functionality, the core functionality and the peripheral functionality each being provided with voltage supply connection and ground connection,
- the carrier substrate is laterally subdivided into a core area and a peripheral area, in which core area the contact pads for the core functionality are provided and in which peripheral area the contact pads for the peripheral functionality are provided, wherein
- the carrier substrate comprises at least one interconnect for interconnecting the ground connections of the peripheral functionality and the core functionality, and
- means for decoupling the voltage supply of core and peripheral functionality to the common ground are present, and
- further provided with a supply series inductor.
5 more elements
Dependencies are inferred from the claim text.