US 7,253,515 B2 · Semiconductor package featuring metal lid member

Abstract

In a semiconductor package, a semiconductor chip is mounted on a wiring board or package board. A lid member defines a recess for accommodating the semiconductor chip, and is mounted on the package board so that the semiconductor chip is accommodated in the recess of the lid member. A first adhesive layer is formed on the package board so that a peripheral portion of the lid member is adhered on the package board with the first adhesive layer. A second adhesive layer is formed on the semiconductor chip so that a central portion of the lid member is adhered to the semiconductor chip with the second adhesive layer. The following relationship is established: 25 μm≦h−d≦300 μm where: “d” is a depth of the recess of the lid member; and “h” is a sum of a thickness of the semiconductor chip and a thickness of the second adhesive layer.

Claims19

Dependent claims

A semiconductor package comprising:

a package board;
a semiconductor chip mounted on said package board;
a lid member defining a recess for accommodating said semiconductor chip and mounted on said package board so that said semiconductor chip is accommodated in the recess of said lid member;
a first adhesive layer formed on said package board so that a peripheral portion of said lid member is adhered on said package board with said first adhesive layer;
and
a second adhesive layer formed on said semiconductor chip so that a central portion of said lid member is adhered to said semiconductor chip with said second adhesive layer,
wherein the following relationship is established:
25μm≦h−d≦300 μm
where:
“d” is a depth of the recess of said lid member;
and “h” is a sum of a thickness of said semiconductor chip and a thickness of said second adhesive layer.

8 more elements

Dependencies are inferred from the claim text.

Semiconductor package featuring metal lid member

Life of this patent

Semiconductor package featuring metal lid member

Life of this patent

Abstract

Claims19