High-frequency switch device and electronic device using the same

A switch device comprising:

• a semiconductor chip;
• at least two switches formed on the semiconductor chip;
• and
• a ground member, arranged between said at least two switches, for reducing an electromagnetic coupling between stationary contacts of said at least two switches,
• the ground member including ground terminals of said at least two switches,
• said ground terminals being arranged between said at least two switches, said ground terminals are arranged on an imaginary line that runs in a direction perpendicular to the direction in which said at least two switches are located in each side of said imaginary line,
• wherein the ground terminals are located closer to terminals corresponding to stationary contacts of said at least two switches than terminals corresponding to movable contacts thereof.

An electronic device comprising:

• a switching device;
• and
• a wiring board on which the switch device is mounted,
• the switch device comprising a semiconductor chip and at least two switches formed on the semiconductor chip, ground parts of said at least two switches being provided between said at least two switches and being electrically connected to a ground formed on the wiring board,
• wherein:
• the ground parts of said at least two switches are pads;
• the switch device is mounted on the wiring board in flip-chip style;
• the wiring board comprises a ground contact pattern to which the pads of said at least two switches are connected, and
• the ground contact pattern is located so as to divide said at least two switches into two groups in a state in which the switch device is mounted on the wiring board.

An electronic device comprising:

• a switching device;
• and
• a wiring board on which the switch device is mounted,
• the switch device comprising a semiconductor chip and at least two switches formed on the semiconductor chip, ground parts of said at least two switches being provided between said at least two switches and being electrically connected to a ground formed on the wiring board,
• wherein:
• the ground parts are formed by a first ground metal common to said at least two switches and provided on a first surface of the semiconductor chip;
• the semiconductor chip has vias connected to the first ground metal;
• and
• the vias are connected to a second ground metal that is formed on the wiring board and contacts a second surface of the semiconductor chip opposite to the first surface.

An electronic device comprising:

• a switch device in a package and components connected to the switch device,
• the switch device comprising a semiconductor chip and at least two switches formed on the semiconductor chip, said at least two switches being separated from each other by 1 mm or less and having respective ground portions provided between said at least two switches,
• the switch device selectively connecting the components between input and output terminals supported by the package,
• the ground parts of said at least two switches are ground terminals located in a spacing between said at least two switches, said ground terminals are arranged on an imaginary line that runs in a direction perpendicular to the direction in which said at least two switches are located in each side of said imaginary line,
• wherein the ground terminals are located closer to terminals corresponding to stationary contacts of said at least two switches than terminals corresponding to movable contacts thereof.

An electronic device comprising:

• a signal processing circuit and a module,
• the module comprising a switch device and components,
• the switch device comprising a semiconductor chip and at least two switches mounted on the semiconductor chip, said at least two switches being separated from each other by 1 mm or less and having respective ground portions provided between said at least two switches,
• the switch device selectively connecting the components between input and output terminals of the module,
• the ground parts of said at least two switches are ground terminals located in a spacing between said at least two switches, said ground terminals are arranged on an imaginary line that runs in a direction perpendicular to the direction in which said at least two switches are located in each side of said imaginary lines,
• wherein the ground terminals are located closer to terminals corresponding to stationary contacts of said at least two switches than terminals corresponding to movable contacts thereof.