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US 7,253,509 B2Granted
Semiconductor device, electronic card and pad rearrangement substrate
AssigneeKabushiki Kaisha Toshiba
InventorsMinori Kajimoto, Osamu Ikeda, Masaki Momodomi
Life of this patent
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Abstract
A semiconductor device comprises a substrate, an external terminal provided on the substrate, an internal wiring pattern electrically connected to the external terminal, a semiconductor chip mounted on the substrate and electrically connected to the internal wiring pattern, and an antenna pattern. The antenna pattern provided at each of adjacent two corner portions of the substrate and is grounded.
Claims20
An electronic card comprising:
- a dielectric substrate having a mounting plane configured to be mounted with a semiconductor chip, and an external terminal plane;
- an internal terminal provided on the mounting plane of the dielectric substrate, and configured to be connected to a bonding pad of the semiconductor chip;
- an external terminal provided on the external terminal plane of the dielectric substrate, and configured to rearrange the bonding pad of the semiconductor chip to be connected to a circuit board;
- an internal wiring pattern provided in the dielectric substrate, and connecting the external terminal to the internal terminal;
- a semiconductor chip mounted on the mounting plane of the dielectric substrate, and electrically connected to the internal terminal;
- an antenna pattern provided at a corner portion of the external terminal plane of the dielectric substrate and configured to be grounded;
- a dummy external terminal provided on the external terminal plane of the dielectric substrate and connected to the antenna pattern;
- a dielectric layer coating the external terminal plane of the dielectric substrate except the external terminal and the dummy external terminal;
- and
- a card outer case housing the substrate and the semiconductor chip.
7 more elements
An electric device comprising:
- a card interface;
- a card slot connected to the card interface;
- and
- an electronic card electrically connected to the card slot,
- the electronic card including:
- a dielectric substrate having a mounting plane configured to be mounted with a semiconductor chip, and an external terminal plane;
- an internal terminal provided on the mounting plane of the dielectric substrate, and configured to be connected to a bonding pad of the semiconductor chip;
- an external terminal provided on the external terminal plane of the dielectric substrate, and configured to rearrange the bonding pad of the semiconductor chip to be connected to a circuit board;
- an internal wiring pattern provided in the dielectric substrate, and connecting the external terminal to the internal terminal;
- a semiconductor chip mounted on the mounting plane of the dielectric substrate, and electrically connected to the internal terminal;
- an antenna pattern, provided at a corner portion of the external terminal plane of the dielectric substrate and configured to be grounded;
- a dummy external terminal provided on the external terminal plane of the dielectric substrate and connected to the antenna pattern;
- a dielectric layer coating the external terminal plane of the dielectric substrate except the external terminal and the dummy external terminal;
- and
- a card outer case housing the substrate and the semiconductor chip.
12 more elements
Dependencies are inferred from the claim text.