Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsShigeo Kouzuki, Satoshi Aida, Satoshi Yanagisawa, Masaru Izumisawa, Hironori Yoshioka
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AssigneeKabushiki Kaisha Toshiba
InventorsShigeo Kouzuki, Satoshi Aida, Satoshi Yanagisawa, Masaru Izumisawa, Hironori Yoshioka
Estimating the term…
A semiconductor device comprises a semiconductor element and a conductive member. The semiconductor element has a semiconductor substrate having first and second major surfaces; a semiconductor layer formed on the first major surface of the semiconductor substrate; a plurality of trenches formed on the semiconductor layer, the trenches being parallel to each other and extending to a first direction; filling material filling the trenches; a first electrode pad provided on the semiconductor layer and connected electrically to a first major electrode; a second major electrode provided on the second major surface; and a gate electrode pad provided on the semiconductor layer and connected to a gate electrode which controls conduction between the first major electrode and the second major electrode. The conductive member is connected to at least one of the first electrode pad and the gate electrode pad via a first contact area. A leading-out direction of the conductive member is substantially parallel to the first direction.
A semiconductor device comprising:
Dependencies are inferred from the claim text.