Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same

An electrical assembly comprising:

• a circuitized substrate including a first layer of organic dielectric material, a first electrically conductive circuit formed on said first layer of organic dielectric material, said first electrically conductive circuit including a first part having a plurality of lines each of a first width and a second part comprising a highly dense pattern of substantially parallel lines each of a second width less than said first width of said lines of said first part of said first electrically conductive circuit;
• a thin, second layer of organic polymer material positioned on said second part of said first electrically conductive circuit comprising said highly dense pattern of substantially parallel lines, and a second electrically conductive circuit positioned on said thin, second layer of organic polymer material and also comprising a highly dense pattern of substantially parallel lines each having a width substantially the same as said second width of said lines of said second part of said first electrically conductive circuit, part of said first layer of organic dielectric material, said second part of said first electrically conductive circuit, said thin, second layer of organic polymer material and said second electrically conductive circuit forming an organic memory device adjacent said first part of said first electrically conductive circuit;
• wherein said thin, second layer of organic polymer material includes opposing ends, said substantially parallel lines of said second electrically conductive circuit further extending down the sides of said opposing ends of said thin, second layer of organic polymer material and onto said first layer of organic dielectric material;
• and
• at least one electrical component positioned on said circuitized substrate and electrically coupled to said first electrically conductive circuit.

An information handling system comprising:

• a housing;
• an electrical assembly positioned substantially within said housing and including a circuitized substrate including a first layer of organic dielectric material, a first electrically conductive circuit formed on said first layer of organic dielectric material, said first electrically conductive circuit including a first part having a plurality of lines each of a first width and a second part comprising a highly dense pattern of substantially parallel lines each of a second width less than said first width of said lines of said first part of said first electrically conductive circuit;
• a thin, second layer of organic polymer material positioned on said second part of said first electrically conductive circuit comprising said highly dense pattern of substantially parallel lines;
• and a second electrically conductive circuit positioned on said thin, second layer of organic polymer material and also comprising a highly dense pattern of substantially parallel lines each having a width substantially the same as said second width of said lines of said second part of said first electrically conductive circuit, part of said first layer of organic dielectric material, said second part of said first electrically conductive circuit, said thin, second layer of organic polymer material and said second electrically conductive circuit forming an organic memory device adjacent said first part of said first electrically conductive circuit;
• wherein said thin, second layer of organic polymer material includes opposing ends, said substantially parallel lines of said second electrically conductive circuit further extending down the sides of said opposing ends of said thin, second layer of organic polymer material and onto said first layer of organic dielectric material;
• and
• at least one electrical component positioned on said circuitized substrate of said electrical assembly and electrically coupled to said first electrically conductive circuit of said circuitized substrate.