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US 7,253,495 B2Granted
Integrated circuit package with air gap
AssigneeMarvell World Trade Ltd.
InventorSehat Sutardja
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) package comprises an IC wafer comprising a circuit. A “C”-shaped layer is arranged adjacent to the substrate and that creates an air gap between the “C”-shaped layer and the circuit of the IC wafer.
Claims19
An integrated circuit (IC) package, comprising:
- an IC wafer comprising a circuit comprising at least one of an inductance and a capacitance;
- and
- a “C”-shaped layer that is arranged adjacent to said IC wafer and that creates an air gap between said “C”-shaped layer and said circuit.
A method for providing an integrated circuit (IC) package, comprising:
- providing an IC wafer comprising an oscillating circuit;
- and
- arranging a “C”-shaped layer adjacent to said IC wafer, wherein said “C”-shaped layer creates an air gap between said “C”-shaped layer and said oscillating circuit of said IC wafer.
An integrated circuit (IC) package, comprising:
- an IC wafer comprising a circuit;
- a “C”-shaped layer that is arranged adjacent to said IC wafer and that creates an air gap between said “C”-shaped layer and said circuit of said IC wafer;
- and
- a molding material that encapsulates at least part of said IC wafer and said “C”-shaped layer.
1 more element
An integrated circuit (IC) package, comprising:
- an IC wafer comprising a circuit;
- and
- a “C”-shaped layer that is arranged adjacent to said IC wafer and that creates an air gap between said “C”-shaped layer and said circuit of said IC wafer,
- wherein said “C”-shaped layer is a single unitary structure.
1 more element
Dependencies are inferred from the claim text.