Light source module of light emitting diode

#This application claims the benefit of Taiwan application Serial No. 94104800, filed Feb. 18, 2005, the subject matter of which is incorporated herein by reference.

#The present invention relates to a light source module, and more particularly relates to a light source module of the light emitting diode (LED).

#Light emitting diode (LED) is a common lighting element. It can be used as an instructor light in the electrical products, or the high power LED can be used for lighting, for example, the high power LED is often used as the backlight for the display devices. However, the lighting efficiency and the life of the LED are affected by the design of the heat dissipation of the light source module. When the LED is in high temperature of the working environment, the light output efficiency will be reduced. By increasing the input current of the power merely products more heat but the temperature of the LED increases, and eventually results in permanent damage.

#FIG. 1A is a cross-sectional view illustrating a light emitting diode package structure of the related art, which is disposed in the metal-based printed circuit board.

#FIG. 1B is a top plan view illustrating a light emitting diode package structure of the related art, which is disposed in a metal-based printed circuit board before encapsulating.

#FIG. 2A is a cross-sectional view illustrating an LED light source module in accordance with a preferred embodiment of the present invention, wherein the light emitting diode package structure is disposed in a printed circuit board.

#The following is the detail description of the present invention. It should be noted and appreciated that the process steps and structures described below does not cover a complete process flow and structure. The present invention can be practiced in conjunction with various fabrication techniques that are used in the art, and only so much of the commonly practiced process steps are included herein as are necessary to provide an understanding of the present invention.

#The present invention will be described in detail with reference to the accompanying drawings. It should be noted that the drawings are in greatly simplified form and they are not drawn to scale. Moreover, dimensions have been exaggerated in order to provide a clear illustration and understanding of the present invention.

#In a preferred embodiment of the present invention, a light source module of the light emitting diode (LED) 2 is provided which includes an LED package structure and a printed circuit board 26 (PCB) for transmitting the input power to LED chip 22. Referring to FIG. 2A and FIG. 2B, there is a cross-sectional view showing an LED package structure of the light source module of the LED 2 disposed in a metal-base PCB 26 and a top plan view showing an LED package structure disposed in a PCB 26 before encapsulated. An LED package structure is composed of a base 21, an LED chip 22, a first thermal conductive element 23, a lead 24 electrically connected to the LED chip 22 and the PCB 26, and a package colloid 25 encapsulating the LED chip 22. Conductive layer 26A is disposed at side of the PCB 26, which is electrically connected to the LED package structure to provide enough power for what the LED package structure needs.