Packaged microelectronic imagers and methods of packaging microelectronic imagers

A microelectronic imaging unit, comprising:

• a microelectronic die including an image sensor, an integrated circuit electrically coupled to the image sensor, and a plurality of terminals electrically coupled to the integrated circuit;
• a cover unit over the image sensor, the cover unit having a window and a side member projecting from the window, the side member being attached to the die;
• electrically conductive interconnects electrically coupled to corresponding terminals and extending through the die;
• and
• an optics unit having an optic member attached to the cover unit, wherein the optics unit is integral with the window and the optic member has a first side in contact with the window and a second side located between the first side and the microelectronic die.

A microelectronic imaging unit, comprising:

• a microelectronic die having a first side, a second side opposite the first side, and a perimeter having end surfaces;
• an image sensor on the first side of the die;
• an integrated circuit in the die and electrically coupled to the image sensor;
• a plurality of bond-pads on the first side of the die and electrically coupled to the integrated circuit;
• a cover unit over the image sensor, the cover unit being a single, unitary component having a window and a side member projecting from the window, and the side member being attached to the die;
• electrically conductive interconnects electrically coupled to corresponding bond-pads and extending through the die;
• and
• an optics unit having a substrate and an optic member attached to the cover unit, wherein the optic member has a first side in contact with the substrate and a second side located between the first side and the microelectronic die.

A plurality of microelectronic imagers, comprising:

• a microfeature workpiece including a plurality of microelectronic dies, the individual dies having an image sensor, an integrated circuit electrically coupled to the image sensor, and a plurality of bond-pads electrically coupled to the integrated circuit;
• a plurality of cover units over corresponding image sensors, the cover units being single, unitary components having a window and a side member integral with and projecting from the window, the individual side members being attached to corresponding individual dies;
• electrically conductive interconnects extending through the individual dies and electrically coupled to corresponding terminals;
• and
• a plurality of optics units, each corresponding to one of the plurality of cover units, each having an optic member attached to the corresponding cover unit, wherein the individual optics units are integral with the respective windows, each optic member having a first side in contact with the window and a second side located between the first side and the corresponding microelectronic die.

A method of packaging a microelectronic imager, comprising:

• providing a microelectronic die having an image sensor, an integrated circuit electrically coupled to the image sensor, and a plurality of terminals electrically coupled to the integrated circuit;
• providing a cover unit having a window and a side member projecting from and integral with the window;
• attaching the cover unit to the die over the image sensor;
• forming a plurality of electrically conductive interconnects electrically coupled to corresponding terminals and extending through the die;
• and
• attaching an optics unit having an optic member to the cover unit, wherein optics unit is integral with the window and the optic member is formed with a first side in contact with the window and a second side located between the first side and the microelectronic die.

A method of packaging a plurality of microelectronic imagers, comprising:

• providing a microfeature workpiece including a plurality of microelectronic dies, the individual dies having an image sensor, an integrated circuit electrically coupled to the image sensor, and a plurality of bond-pads electrically coupled to the integrated circuit;
• providing a plurality of cover units, the cover units being single, unitary components having a window and a side member;
• attaching individual cover units to individual dies over corresponding image sensors;
• forming a plurality of electrically conductive interconnects extending through individual dies and/or electrically coupled to corresponding bond-pads;
• and
• attaching a plurality of optics units having a substrate and an optic member to corresponding individual cover units, wherein each of the optic members has a first side in contact with the individual substrate and a second side located between the first side and the corresponding microelectronic die.