Thermosetting polycarbodiimide copolymer
AssigneeNisshinbo Industries, Inc.
InventorsIkuo Takahashi, Hideshi Tomita
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AssigneeNisshinbo Industries, Inc.
InventorsIkuo Takahashi, Hideshi Tomita
Estimating the term…
A thermosetting polycarbodiimide copolymer of the present invention comprises in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two mixed alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene; and a hard segment made of polycarbodiimide bonded to the soft segment through at least one bond selected from the group consisting of an urethane bond, a urea bond and an amide bond. The thermosetting polycarbodiimide copolymer can exhibit not only a high heat resistance and a good flexibility, but also an excellent flexing resistance (resistance to 180° bending),and can be, therefore, suitably used in applications of various electronic parts, for example, as materials of base films or cover-lay films for flexible wiring boards, or adhesive films.
A thermosettable polycarbodiimide copolymer comprising in a molecule thereof, a soft segment containing at least one residue formed by removing opposite functional end groups of polytetramethylene ether glycol, polyether block amide and polyalkylene carbonate diol having at least two alkylene chains selected from the group consisting of hexamethylene, pentamethylene and tetramethylene;
A thermosettable polycarbodiimide copolymer containing constituting units each represented by the general formula (I):
A process for producing a thermosettable polycarbodiimide copolymer containing constituting units each represented by the general formula (I):
Dependencies are inferred from the claim text.