Deposition method of TiN thin film having a multi-layer structure

A method of depositing a metal nitride film having a multilayer structure and different deposition speeds on a substrate, the method comprising the steps of:

• (a) depositing an ALD TiN film on the substrate at a first deposition speed;
• (b) forming a lower TiN film by depositing a CVD TiN film on the ALD TiN film at a second deposition speed;
• and
• (c) depositing an upper TiN film having a large content of nitrogen (N) on the lower TiN film at a third deposition speed to improve stability with respect to exposure to air/moisture,
• wherein the deposition speed of the metal nitride film having a multi-layer structure satisfies a relationship that the second deposition speed≧the first deposition speed≧the third deposition speed.

A method of depositing a metal nitride film having a multilayer structure and different deposition speeds on a substrate, the method comprising the steps of:

• (a) depositing a first ALD TiN film on the substrate at a first deposition speed;
• (b) forming a lower TiN film by depositing a second ALD TiN film on the first ALD TiN film at a second deposition speed;
• and
• (c) depositing an upper TiN film having a large content of nitrogen (N) on the lower TiN film at a third deposition speed to improve stability with respect to exposure to air/moisture,
• wherein the deposition speed of the metal nitride film having a multi-layer structure satisfies a relationship that the second deposition speed≧the first deposition speed≧the third deposition speed.

A method of depositing a metal nitride film having a multilayer structure and different deposition speeds on a substrate, the method comprising the steps of:

• (a) depositing a first CVD TiN film on the substrate at a first deposition speed;
• (b) forming a lower TiN film by depositing a second CVD TiN film on the first CVD TiN film at a second deposition speed;
• and
• (c) depositing an upper TiN film having a large content of nitrogen (N) on the lower TiN film at a third deposition speed to improve stability with respect to exposure to air/moisture,
• wherein the deposition speed of the metal nitride film having a multi-layer structure satisfies a relationship that the second deposition speed≧the first deposition speed≧the third deposition speed.