Chip scale surface mounted device and process of manufacture
AssigneeInternational Rectifier Corporation
InventorsMartin Standing, Hazel Deborah Schofield
Life of this patent
Estimating the term…
Abstract
A chip scale package has a semiconductor MOSFET die which has a top electrode surface covered with a layer of a photosensitive liquid epoxy which is photolithographically patterned to expose portions of the electrode surface and to act as a passivation layer and as a solder mask. A solderable contact layer is then formed over the passivation layer. The individual die are mounted drain side down in a metal clip or can with the drain electrode disposed coplanar with a flange extending from the can bottom.
Claims29
A process for fabricating a semiconductor device package, comprising:
- covering a side of a MOSgated device wafer with a passivation layer, said passivation layer being capable of serving as a solder mask;
- forming openings in said passivation layer to produce a plurality of spaced exposed surface areas of underlying source and a similar opening to expose underlying gate electrode of each die, wherein said openings in said passivation layer reach an underlying solderable top metal;
- singulating said wafer into individual die;
- and
- electrically attaching an individual die at a drain side thereof to a drain clip.
A process for fabricating a semiconductor device package, comprising:
- covering a side of a MOSgated device wafer with a passivation layer, said passivation layer being capable of serving as a solder mask and a plating resist;
- forming openings in said passivation layer to produce a plurality of spaced exposed surface areas of underlying source and a similar opening to expose underlying gate electrode of each die;
- plating said underlying source and gate electrodes using said passivation layer as a plating resist, thereby forming a solderable contact on said source electrode and a solderable contact on said gate electrode;
- singulating said wafer into individual die;
- and
- electrically attaching an individual die at drain side thereof to a drain clip.
Dependencies are inferred from the claim text.