US 7,253,089 B2 · Microfeature devices and methods for manufacturing microfeature devices

Abstract

Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated circuit, a surface, and a plurality of interconnect elements projecting from the surface and arranged in arrays on the surface. In one embodiment, a method includes forming a coating on the interconnect elements of the microfeature workpiece, producing a layer over the surface of the microfeature workpiece after forming the coating, and removing the coating from at least a portion of the individual interconnect elements. The coating has a surface tension less than a surface tension of the interconnect elements to reduce the extent to which the material in the layer wicks up the interconnect elements and produces a fillet at the base of the individual interconnect elements.

Claims31

Dependent claims

A method for manufacturing a microfeature workpiece, the microfeature workpiece having an integrated circuit, a surface, and a plurality of conductive interconnect elements projecting from the surface and arranged in arrays on the surface, the method comprising:

forming a coating on at least the interconnect elements of the microfeature workpiece, the coating having a surface tension less than a surface tension of the interconnect elements;
producing a layer over the surface of the microfeature workpiece after forming the coating;
and
removing the coating from at least a portion of the individual interconnect elements.

1 more element

Dependencies are inferred from the claim text.

Microfeature devices and methods for manufacturing microfeature devices

Life of this patent

Microfeature devices and methods for manufacturing microfeature devices

Life of this patent

Abstract

Claims31