Method of producing thin-film device, electro-optical device, and electronic apparatus
AssigneeSeiko Epson Corporation
InventorSumio Utsunomiya
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AssigneeSeiko Epson Corporation
InventorSumio Utsunomiya
Estimating the term…
The invention provides a transfer technique by which the dimensional precision of a thin-film device is not deteriorated, even if the device is produced by transferring a fine structure or a thin-film circuit layer onto a substrate with an inferior shape-stability. The method includes: forming a fine structure or a thin-film circuit layer on a first substrate using a photolithographic patterning process; shifting the fine structure or the thin-film circuit layer from the first substrate onto a second substrate, or shifting the fine structure or the thin-film circuit layer from the first substrate onto the second substrate via a third substrate; and forming a thin-film pattern on the fine structure or the thin-film circuit layer shifted onto the second substrate by a non-photolithographic method.
A method of manufacturing an active matrix substrate, comprising:
A method of manufacturing an active matrix substrate, the method comprising:
Dependencies are inferred from the claim text.