Method of forming a gate insulator in group III-V nitride semiconductor devices
AssigneeTekcore Co., Ltd.
InventorsLung-Han Peng, Han-Ming Wu, Jing-Yi Lin
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Abstract
A method of forming a gate insulator in the manufacture of a semiconductor device comprises conducting a photo-assisted electrochemical process to form a gate-insulating layer on a gallium nitride layer of the semiconductor device, wherein the gate-insulating layer includes gallium oxynitride and gallium oxide, and performing a rapid thermal annealing process. The photo-assisted electrochemical process uses an electrolyte bath including buffered CH3COOH at a pH between about 5.5 and 7.5. The rapid thermal annealing process is conducted in O2 environment at a temperature between about 500° C. and 800° C.
Claims9
A method of forming a gallium nitride semiconductor device, comprising:
- forming an n-type gallium nitride layer over a substrate;
- conducting a photo-assisted electrochemical process to form a gate-insulating layer on the n-type gallium nitride, wherein the gate-insulating layer includes gallium oxide and gallium oxynitride with a graded composition;
- performing a thermal annealing process;
- and
- forming a gate electrode on the gate-insulating layer.
Dependencies are inferred from the claim text.