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US 7,253,029 B2Granted
Non-magnetic, hermetically-sealed micro device package
AssigneeM/A-Com, Inc.
InventorsCarl Geisler, Dennis O'Keefe
Life of this patent
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Abstract
A process for preparing an electronic package comprising: (a) providing a ceramic housing defining an internal cavity for receiving a micro device and having one or more interface portions; (b) treating the housing to form a tungsten layer on the interface portions; and (c) overlaying a palladium layer on the tungsten layer.
Claims8
A process for preparing an electronic package comprising:
- providing a ceramic housing defining an internal cavity for receiving a micro device and having at least one interface portion;
- treating said housing to form a tungsten layer on said interface portion;
- and
- overlaying a palladium layer on said tungsten layer on said interface portion to render it a solderable interface portion suitable for soldering to another component;
- disposing said micro device in said cavity, and
- placing a lid on said housing along said solderable interface portion and exposing said housing to temperatures sufficient to reflow said palladium layer to form a solder seal between said housing and said lid.
3 more elements
Dependencies are inferred from the claim text.