Method of manufacturing hybrid integrated circuit device
AssigneeSanyo Electric Co., Ltd.
InventorMasaru Kanakubo
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Abstract
A method of manufacturing a hybrid integrated circuit device includes the steps of forming a plurality of units each including a conductive pattern on a surface of a board made of metal, forming grooves along boundaries of the respective units of the board, electrically connecting circuit elements to the conductive patterns in the respective units, separating the respective circuit boards by dividing the board along the grooves, and flattening side surfaces of the circuit boards by pressing the side surfaces.
Claims6
A method of manufacturing a hybrid integrated circuit device comprising:
- forming a plurality of units each including a conductive pattern on a front surface of a board;
- electrically connecting circuit elements to the conductive patterns in the respective units;
- separating respective circuit boards by dividing the board along boundaries of the units;
- and
- flattening side surfaces of the circuit boards by pressing the side surfaces.
A method of manufacturing a hybrid integrated circuit device comprising:
- forming a plurality of units each including a conductive pattern on a surface of a board made of metal;
- forming grooves along boundaries of the respective units of the board;
- electrically connecting circuit elements to the conductive patterns in the respective units;
- separating respective circuit boards by dividing the board along the grooves;
- and
- flattening side surfaces of the circuit boards by pressing the side surfaces.
Dependencies are inferred from the claim text.