Ultra-thin semiconductor package device and method for manufacturing the same

A method o F manufacturing an ultra-thin semiconductor package device, said method comprising:

• preparing a wafer having a plurality of semiconductor chips formed on an active surface of the wafer;
• attaching an adhesive layer to the backside of the semiconductor chips and attaching a UV tape to the adhesive layer;
• irradiating the UV tape with UV light to remove the adhesiveness between the UV tape and the adhesive layer;
• cutting the wafer into the plurality of semiconductor chips;
• preparing a lead frame comprising a die pad, a tie bar connected to and supporting the die pad, and a plurality of leads disposed around the die pad;
• defining a chip attaching part and a peripheral part on the die pad, said peripheral part surrounding the chip attaching part;
• etching the chip attaching part so that the chip attaching part has a thickness less than a thickness of the leads;
• removing the plurality of semiconductor chips from the wafer state UV tape, wherein the adhesive layer remains attached to the backside of the chips;
• die bonding the semiconductor chips to the chip attaching part of the die pad using the adhesive layer;
• wire bonding the semiconductor chips to the leads;
• and
• forming a package body by encapsulating the semiconductor chips, bonding wires, and a portion of the leads.

A method of manufacturing an ultra-thin semiconductor package device, said method comprising:

• preparing a lead frame comprising a die pad, a tie bar connected to and supporting the die pad, and a plurality of leads disposed around the die pad;
• defining a chip attaching part and a peripheral part on the die pad, said peripheral part surrounding the chip attaching part;
• etching the chip attaching part so that the chip attaching part has a thickness less than a thickness of the leads, wherein the amount of etching is determined by a pressure and an applying time of an etchant;
• die bonding a semiconductor chip to the chip attaching part of the die pad;
• wire bonding the semiconductor chip to the leads;
• and
• forming a package body by encapsulating the semiconductor chip, bonding wires, and a portion of the leads.