Multiple substrate microelectronic devices and methods of manufacture

A method for forming a packaged compound microelectronic device, comprising:

• forming a first microelectronic substrate having a first surface, a second surface opposite the first surface, a first operable microelectronic device, and a first connection terminal at the first surface coupled to the first microelectronic device;
• forming a second microelectronic substrate having a first surface, a second surface opposite the first surface, a second operable microelectronic device, and a second connection terminal at the first surface coupled to the second microelectronic device;
• bonding the first and second microelectronic substrates together by placing the second surface of the first microelectronic substrate directly against the second surface of the second microelectronic substrate without an adhesive between the first and second microelectronic substrates;
• engaging at least one of the first and second microelectronic substrates with a conductive support member;
• electrically coupling the first and second connection terminals to the conductive support member;
• and
• packaging the first and second microelectronic substrates together by surrounding both microelectronic substrates with a single package enclosure.

A method for forming a compound microelectronic device, comprising:

• forming first and second microelectronic substrates to each have a first surface, a second surface opposite the first surface, an operable microelectronic device, and a connection terminal at the first surface coupled to the microelectronic device;
• bonding at least a first part of the first microelectronic substrate to at least a second part of the second microelectronic substrate by placing the second surface of the first microelectronic substrate directly against the second surface of the second microelectronic substrate without an adhesive between the first and second microelectronic substrates;
• coupling the connection terminal of the first microelectronic substrate to a first bond site on an intermediate surface of the first microelectronic substrate between the first and second surfaces of the first microelectronic substrate;
• coupling the connection terminal of the second microelectronic substrate to a second bond site on an intermediate surface of the second microelectronic substrate between the first and second surfaces of the second microelectronic substrate;
• and
• attaching the first part of the first microelectronic substrate and the second part of the second microelectronic substrate as a unit to a support member with the intermediate surfaces of the microelectronic substrates facing toward the support member.

A method for forming a microelectronic device, comprising:

• forming a first microelectronic substrate to have a first surface, a second surface opposite the first surface, an intermediate surface between the first and second surfaces, a first operable microelectronic device, and a first connection terminal at the intermediate surface coupled to the first microelectronic device;
• forming a second microelectronic substrate to have a first surface, a second surface opposite the first surface, an intermediate surface between the first and second surfaces, a second operable microelectronic device, and a second connection terminal at the intermediate surface coupled to the second microelectronic device;
• and
• bonding at least a first part of the first microelectronic substrate to at least a second part of the second microelectronic substrate by placing the second surface of the first microelectronic substrate directly against the second surface of the second microelectronic substrate without an adhesive between the first and second microelectronic substrates.

A method for forming a packaged compound microelectronic device, comprising:

• forming a first microelectronic substrate having a first surface, a second surface opposite the first surface, a first operable microelectronic device, and a first connection terminal at the first surface coupled to the first microelectronic device;
• forming a second microelectronic substrate having a first surface, a second surface opposite the first surface, a second operable microelectronic device, and second connection terminal at the first surface coupled to the second microelectronic device;
• bonding the first and second microelectronic substrates together by placing the second surface of the second microelectronic substrate directly against the first surface of the first microelectronic substrate without an adhesive between the first and second microelectronic substrates;
• and
• packaging the first and second microelectronic substrates together by surrounding both microelectronic substrates with a single package enclosure.

A method for forming a compound microelectronic device, comprising:

• forming a first microelectronic substrate having a first surface, a second surface opposite the first surface, a first operable microelectronic feature, and a first connection terminal coupled to the first microelectronic feature;
• forming a second microelectronic substrate having a first surface, a second surface opposite the first surface, a second operable microelectronic feature, and a second connection terminal coupled to the second microelectronic feature;
• and
• bonding the first and second microelectronic substrates together by placing the second surface of the second microelectronic substrate directly against the first or second surface of the first microelectronic substrate without an adhesive between the first and second microelectronic substrates.

A method for forming a compound microelectronic device, comprising:

• forming a first microelectronic substrate having a first surface, a second surface opposite the first surface, a first operable microelectronic device, and a first connection terminal coupled to the first microelectronic device;
• forming a second microelectronic substrate having a first surface, a second surface opposite the first surface, a second operable microelectronic device, and a second connection terminal coupled to the second microelectronic device;
• and
• bonding the first and second microelectronic substrates together by placing the second surface of the second microelectronic substrate directly against the first or second surface of the first microelectronic substrate without an adhesive between the first and second microelectronic substrates.

A method for forming a compound microelectronic device, comprising:

• forming a first microelectronic substrate having a first surface, a second surface opposite the first surface, a first operable microelectronic device, and a first connection terminal coupled to the first microelectronic device;
• forming a second microelectronic substrate having a first surface, a second surface opposite the first surface, a second operable microelectronic device, and a second connection terminal coupled to the second microelectronic device;
• and
• removing material from the second surfaces of the first and second microelectronic substrates by chemically and/or chemically-mechanically planarizing the second surfaces;
• and
• bonding the first and second microelectronic substrates together by placing the second surface of the second microelectronic substrate directly against the first or second surface of the first microelectronic substrate without an adhesive between the first and second microelectronic substrates.