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US 7,253,021 B2Granted
Transfer molding apparatus and method for manufacturing semiconductor devices
AssigneeOki Electric Industry Co., Ltd.
InventorsHiroyuki Nishi, Akira Sugai
Life of this patent
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Abstract
A method of transfer molding, wherein a top-half mold and a bottom-half mold of an apparatus form a plurality of cavities interconnected, and wherein a pressure adjuster reduces the pressure of the cavities every time a specified amount of resin is supplied into any one of a plurality of cavities.
Claims12
A method of manufacturing a semiconductor device, comprising:
- placing a lead frame having a semiconductor element mounted thereon, between a top-half mold and a bottom-half mold;
- forcing resin into a cavity formed by the top-half mold and the bottom-half mold using a plunger;
- reducing a pressure in the cavity by extracting air from the cavity using a suction pump, when a specified amount of resin has been supplied to the cavity;
- and
- detecting a position of the plunger using a position sensor, to determine when the specified amount of resin has been supplied to the cavity.
2 more elements
A method of manufacturing a semiconductor device, comprising:
- placing a lead frame having a semiconductor element mounted thereon, between a top-half mold and a bottom-half mold;
- forcing resin into a cavity formed by the top-half mold and the bottom-half mold using a plunger;
- reducing a pressure in the cavity by extracting air from the cavity using a suction pump, when a specified amount of resin has been supplied to the cavity;
- and
- detecting an amount of time the plunger is driven using a timer, to determine when the specified amount of resin has been supplied to the cavity.
2 more elements
A method of manufacturing a semiconductor device, comprising:
- placing a lead frame having a semiconductor element mounted thereon, between a top-half mold and a bottom-half mold;
- introducing resin into a cavity formed by the top-half mold and the bottom-half mold using a plunger;
- determining an amount of time the plunger is driven using a timer;
- and
- reducing a pressure in the cavity by extracting air from the cavity using a suction pump, according to the amount of time the plunger is driven.
2 more elements
A method of manufacturing semiconductor device packages comprising:
- providing a transfer molding apparatus including a top-half mold and a bottom-half mold that forms a cavity as a molding space for a package, a transfer pot as a resin loading space, and a plunger that communicates with the transfer pot to force resin out of the pot and into the cavity;
- placing a lead frame having a semiconductor element mounted thereon between the top-half mold and the bottom-half mold within the cavity;
- introducing resin into the cavity using the plunger;
- and
- reducing a pressure in the cavity using a suction pump to extract air from the cavity when a specified amount of resin has been introduced to the cavity, to form a semiconductor device package.
2 more elements
Dependencies are inferred from the claim text.