Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorHideki Higashitani
Life of this patent
Estimating the term…
Abstract
A wiring transfer sheet including a carrier base and a wiring layer formed thereon is produced so that an exposed area of a surface of the carrier base on which the wiring layer is formed has a plurality of concavities. By transferring the wiring layer to an electrically insulating substrate with this wiring transfer sheet, convexities which are complementary to the concavities are formed on the electrically insulating substrate. The convexities improve adhesion between a wiring board and a resin stacked thereon. Therefore, the wiring board thus obtained has surface coplanarity suitable for mounting a semiconductor bare chip and an electronic component as a whole, and a microscopical surface structure which adheres to a material stacked thereon.
Claims14
A wiring board comprising:
- an electrically insulating substrate;
- and
- a wiring layer formed on a surface of said electrically insulating substrate by transferring said wiring layer from a wiring transfer sheet, an exposed portion of said surface of said electrically insulating substrate being a rough surface having a plurality of convexities, at least a portion of said convexities each having a shape such that sections perpendicular to a height direction of each convexity are not uniform, and such that a maximum-sized section having a maximum area is located at an intermediate position between a basis and a top of each convexity.
A wiring board comprising:
- an electrically insulating substrate;
- and
- a wiring layer formed on a surface of said electrically insulating substrate by transferring said wiring layer from a wiring transfer sheet, an exposed portion of said surface of said electrically insulating substrate being a rough surface having a plurality of convexities, at least a portion of said convexities each having a diameter in a range of 0.5 μm to 5.0 μm at basis.
A wiring board comprising:
- an electrically insulating substrate;
- and
- a wiring layer formed on a surface of said electrically insulating substrate by transferring said wiring layer from a wiring transfer sheet, an exposed portion of said surface of said electrically insulating substrate being a rough surface having a plurality of convexities, at least a portion of said convexities each having a height in a range of 0.5 μm to 5.0 μm.
Dependencies are inferred from the claim text.