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US 7,252,878 B2Granted
High barrier flexible packaging structure
AssigneeToray Plastics (America), Inc.
InventorsHiroaki Watanabe, Mark S. Lee
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Abstract
The invention relates to a high oxygen barrier, multilayer flexible packaging structure having a vacuum metallized, biaxially oriented polypropylene (met-BOPP) or metallized polyester (met-PET) film substrate; a high barrier EVOH layer coextruded or laminated directly on the metal-containing layer; and optionally an adjacent layer of anhydride modified polyolefin such as blend of LDPE, or MDPE, or PP and maleic anhydride modified adhesive resin on the EVOH layer.
Claims21
A laminate film, comprising, in this order:
- a biaxially oriented polymer film substrate;
- a metal-containing layer;
- and
- an EVOH layer directly on the metal-containing layer, wherein said metal-containing layer has an optical density of about 1.5 to 5.0.
1 more element
A laminate film, consisting of:
- a biaxially oriented polymer film substrate;
- a metal-containing layer on the substrate;
- and
- an EVOH layer directly on the metal-containing layer, wherein said metal-containing layer has an optical density of about 1.5 to 5.0.
1 more element
Dependencies are inferred from the claim text.