Polymer matrices for polymer solder hybrid materials
AssigneeIntel Corporation
InventorsSaikumar Jayaraman, Paul A. Koning, Ashay Dani
Life of this patent
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Abstract
Embodiments of the present invention provide various polymeric matrices that may be used as a binder matrix for polymer solder hybrid thermal interface materials. In alternative embodiments the binder matrix material may be phophozene, perfluoro ether, polyether, or urethane. For one embodiment, the binder matrix is selected to provide improved adhesion to a variety of interfaces. For an alternative embodiment the binder matrix is selected to provide low contact resistance. In alternative embodiments, polymeric materials containing fusible and non-fusible particles may be used in application where heat removal is desired and is not restricted to thermal interface materials for microelectronic devices.
Claims28
A thermal interface material comprising:
- a polymeric matrix material selected from the group consisting of phophozene resin and perfluoro ether resin;
- fusible particles in the matrix material, the fusible particles having a melting point below a specified temperature;
- and
- non-fusible particles in the matrix material, the non-fusible particles having a melting point above the specified temperature.
An apparatus comprising:
- an electronic component;
- a thermally conductive member;
- and
- a thermal interface material, thermally coupling the electronic component to the thermally conductive member, the thermal interface material having a polymeric matrix material selected from the group consisting of phophozene resin and perfluoro ether resin, fusible particles within the matrix material, the fusible particles having a melting point below a specified temperature and non-fusible particles in the matrix material, the non-fusible particles having a melting point above the specified temperature.
A thermal interface material comprising:
- a binder matrix material selected from the group consisting of phosphozene resin, and perfluoro ether resin;
- solder particles having a melting temperature below a temperature;
- and
- filler particles having a melting temperature above the temperature.
Dependencies are inferred from the claim text.