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US 7,252,874 B2Granted
Heat-sensitive stencil, method of preparing stencil printing master and stencil printer
AssigneeTohoku Ricoh Co., Ltd.
InventorTomiya Mori
Life of this patent
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Abstract
A heat-sensitive stencil including a thermoplastic resin film on which a porous resin layer and a porous reinforcing layer are formed in succession. A porous fibrous layer may be disposed between the porous resin layer and the porous reinforcing layer.
Claims19
A heat-sensitive stencil comprising:
- a thermoplastic resin film,
- a porous resin layer provided on said thermoplastic resin film, and
- one or more porous reinforcing layers having a tensile strength of at least 385 N/m,
- wherein the one or more porous reinforcing layers are provided on a side of said porous resin layer which is opposite to the thermoplastic resin film, and
- wherein at least one of said porous reinforcing layers is a fibrous layer formed from fibers having a diameter at least 21 μm.
2 more elements
Dependencies are inferred from the claim text.