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US 7,252,871 B2Granted
Polishing pad having a pressure relief channel
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorsT. Todd Crkvenac, Robert T. Gamble, Jason M. Lawhorn
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Abstract
The present invention provides a chemical mechanical polishing pad comprising a window formed in the polishing pad, the window having a void provided on a side thereof. The polishing pad further comprises a void-pressure relief channel provided in the polishing pad from the void to a periphery of the polishing pad.
Claims11
A chemical mechanical polishing pad comprising:
- a polishing layer having a polishing surface and a window block;
- and
- a bottom layer having a void;
- wherein the polishing layer overlies the bottom layer;
- wherein the void in the bottom layer underlies the window block on a side of the window block opposite the polishing surface of the polishing layer and a void-pressure relief channel extending from the void to a periphery of the polishing pad;
- wherein the void-pressure relief channel does not extend to the polishing surface.
3 more elements
A chemical mechanical polishing pad comprising:
- a polishing layer having a polishing surface and a window block formed therein, and a bottom layer;
- wherein the polishing layer overlies the bottom layer and wherein the window block is exposed to a void on a side of the polishing layer opposite the polishing surface and a void-pressure relief channel provided in the polishing layer extending from the void exposed side of the window block to a periphery of the polishing layer;
- and wherein the void-pressure relief channel does not extend to the polishing surface.
A chemical mechanical polishing pad comprising:
- a polishing layer overlying a bottom layer, and an adhesive layer disposed between the polishing layer and the bottom layer;
- a window block formed in the polishing layer, the window block being exposed to a void on a side thereof opposite a polishing surface of the polishing pad;
- a void-pressure relief channel provided in the adhesive layer from the void to a periphery of the adhesive layer;
- and
- wherein the void-pressure relief channel does not extend to the polishing surface.
2 more elements
A chemical mechanical polishing pad comprising:
- a polishing layer overlying a bottom layer, and an adhesive layer disposed between the polishing layer and the bottom layer;
- a window block formed in the polishing layer, the window block being exposed to a void on a side thereof opposite a polishing surface of the polishing pad;
- a void-pressure relief channel provided in the bottom layer from the void to a periphery of the bottom layer;
- wherein the void-pressure relief channel does not extend to the polishing surface.
1 more element
Dependencies are inferred from the claim text.