Ejecting load monitoring method for injection molding machine
AssigneeToshiba Machine Co., Ltd.
InventorMakoto Nishizawa
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AssigneeToshiba Machine Co., Ltd.
InventorMakoto Nishizawa
Estimating the term…
A movable die is held on the front face of a movable platen. Ejector pins are incorporated in the movable die. An ejector unit that is provided with an ejector plate, actuator rods, etc., is mounted on the back of the movable platen. In ejecting a molded product from a die face, the ejector plate is advanced to cause the actuator rods to push out the ejector pins. In the ejecting load monitoring method of the invention, a plurality of monitoring sections are provided in a movement area of the ejector plate (or the actuator rod), and an upper limit value of a forward thrust load of the ejector plate is previously set for each monitoring section. An alarm is issued when the forward thrust load of the ejector plate reaches the upper limit value set for any of the monitoring sections during the ejecting operation.
An ejecting load monitoring method for an injection molding machine which comprises a movable die having an ejector pin therein, a movable platen which holds the movable die, and an ejector unit having an actuator rod, the actuator rod is attached to the back side of the movable platen and is used to advance and/or retreat the ejector pin when ejecting a molded product from a die face,
Dependencies are inferred from the claim text.