Dual contact ring and method for metal ECP process

A method of electroplating a metal on a substrate and removing the metal from a selected region on the substrate, comprising the steps of:

• providing a first ring in contact with the substrate;
• providing a second ring in contact with the selected region on the substrate;
• electroplating the metal onto the substrate by applying a negative voltage to the substrate through said first ring;
• and
• removing the metal from the selected region on the substrate by applying a positive voltage or ground contact to the selected region on the substrate through said second ring.

A method of electroplating a metal on a substrate and removing the metal from a selected region on the substrate, comprising the steps of:

• providing a first ring in contact with the substrate;
• providing a second ring in contact with the selected region on the substrate;
• providing an isolation ring between said first ring and said second ring;
• electroplating the metal onto the substrate by applying a negative voltage to the substrate through said first ring;
• and
• removing the metal from the selected region on the substrate by applying a positive voltage to the selected region on the substrate through said second ring.