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US 7,252,738 B2Granted
Apparatus for reducing polymer deposition on a substrate and substrate support
AssigneeLam Research Corporation
InventorsJose Tong, Eric H Lenz
Life of this patent
Estimating the term…
Abstract
An adjustable RF coupling ring is capable of reducing a vertical gap between a substrate and a hot edge ring in a vacuum processing chamber. The reduction of the gap reduces polymer deposits on the substrate and electrostatic chuck and improves wafer processing.
Claims17
A plasma processing apparatus comprising:
- a processing chamber;
- a power source which energizes process gas in an interior of the processing chamber into a plasma state for processing a substrate;
- a substrate support which supports a substrate within the interior of the processing chamber, the substrate support having an upper surface;
- an upper ring surrounding the substrate support, the upper ring having a portion extending under a substrate when the substrate is located on the substrate support;
- and
- a coupling ring surrounding the substrate support, the coupling ring having a first ring rotatable with respect to a second ring to adjust height of the coupling ring and adjust a gap between the upper ring and the substrate.
3 more elements
An adjustment mechanism for adjusting a gap between a substrate and a surrounding ring in a plasma processing apparatus, the adjustment mechanism comprising:
- a first ring having at least three projections extending from the first ring in a direction parallel to an axis of the first ring;
- and
- a second ring having at least three sets of a plurality of steps arranged to receive each of the at least three projections, wherein a total thickness of the first and second rings is adjustable by rotation of the first ring with respect to the second ring.
Dependencies are inferred from the claim text.