Apparatus and method for thermally controlled processing of microelectronic workpieces

An apparatus for processing a microelectronic workpiece, comprising:

• a first vessel configured to carry a processing liquid, the first vessel having an exit portion positioned to pass at least a portion of the processing liquid from the first vessel;
• a second vessel, wherein the first vessel is positioned within the second vessel so as to be partially immersible in, and in thermal communication with, the processing liquid that is received in the second vessel from the first vessel;
• and
• a diffuser positioned at least proximate to an entrance portion of the first vessel, wherein the diffuser has at least one entrance port, a plenum region in fluid communication with the at least one entrance port, a primary exit port disposed annularly inwardly from the plenum region, at least one primary flow passage coupled between the plenum region and the primary exit port, at least one secondary exit port disposed annularly outwardly from the primary exit port, and at least one secondary flow passage coupled between the plenum region and the at least one secondary exit port.

A tool for processing a microelectronic workpiece, comprising:

• an input/output station positioned to receive microelectronic workpieces;
• a plurality of processing stations proximate to the input/output station;
• and
• a transfer device positioned to move microelectronic workpieces among the processing stations, wherein at least one of the processing stations includes:
• a first vessel configured to carry a processing liquid, the first vessel having an inlet positioned to receive the processing liquid, the first vessel further having an exit positioned to pass the processing liquid exiting the first vessel;
• a second vessel within which the first vessel is positioned so as to be at least partially immersible in, and in thermal communication with, the processing liquid that is received into a first region, the first region being located within the second vessel and between the first and second vessels, and the second vessel having an inlet positioned to receive the processing liquid;
• and
• a heat exchanger positioned in the first region and connected to the second vessel inlet and to the first vessel inlet, the heat exchanger being in thermal communication with the processing liquid received into the first region such that the processing liquid flowing from the second vessel inlet through the heat exchanger to the first vessel inlet will be in thermal communication with the processing liquid within the first region.

A tool for processing a microelectronic workpiece, comprising:

• an input/output station positioned to receive microelectronic workpieces;
• a plurality of processing stations proximate to the input/output station;
• and
• a transfer device positioned to move microelectronic workpieces among the processing stations, wherein a first processing station includes:
• a first vessel configured to carry a first processing liquid, the first vessel having an inlet positioned to receive the first processing liquid and an exit positioned to pass at least a portion of the first processing liquid from the first vessel;
• a second vessel within which the first vessel is positioned so as to be partially immersible in, and in thermal communication with, the first processing liquid that is received into the second vessel from the exit portion of the first vessel, the second vessel having an inlet;
• and
• a heat exchanger positioned between the first and second vessels, the heat exchanger being connected between the inlet of the first vessel and the inlet of the second vessel and being in thermal communication with the first processing liquid received in the second vessel so that first processing liquid flowing from the second vessel inlet through the heat exchanger to the first vessel inlet will be in thermal communication with first processing liquid in the second vessel;
• and
• wherein a second processing station includes:
• a third vessel configured to carry a second processing liquid, the third vessel having an inlet positioned to receive the second processing liquid and an exit positioned to pass at least a portion of the second processing liquid from the third vessel;
• a fourth vessel within which the third vessel is positioned so as to be partially immersible in, and in fluid communication with, the second processing liquid that is received into the fourth vessel from the exit of the third vessel, the fourth vessel having an inlet;
• and
• a heat exchanger positioned between the third and fourth vessels, the heat exchanger being connected between the inlet of the third vessel and the inlet of the fourth vessel and being in thermal communication with the second processing liquid received in the fourth vessel so that second processing liquid flowing from the fourth vessel inlet through the heat exchanger to the third vessel inlet will be in thermal communication with second processing liquid in the fourth vessel.

A station for processing microelectronic workpieces, comprising:

• a vessel configured to carry a processing liquid, the vessel having an entrance portion positioned to receive the processing liquid, the vessel further having an exit portion positioned to pass the processing liquid exiting the vessel, the vessel having a thermally transmissive vessel wall configured to transfer heat between a first region external to the vessel and a second region internal to the vessel;
• a heat transfer device positioned in the first region, the heat transfer device being thermally coupled to the vessel wall to transfer heat to or from the vessel wall;
• and
• a diffuser positioned in fluid communication with the entrance portion of the vessel, the diffuser including a diffuser body having at least one entrance port, a plenum region in fluid communication with the at least one entrance port, a primary exit port disposed annularly inwardly from the plenum region, at least one primary flow passage coupled between the plenum region and the primary exit port, at least one secondary exit port disposed annularly outwardly from the primary exit port, and at least one secondary flow passage coupled between the plenum region and the at least one secondary exit port, the at least one secondary exit port being smaller than the primary exit port.

A tool for processing a microelectronic workpiece, comprising:

• an input/output station positioned to receive microelectronic workpieces;
• a plurality of processing stations proximate to the input/output station;
• and
• a transfer device positioned to move microelectronic workpieces among the processing stations, wherein at least one of the processing stations includes:
• a vessel configured to carry a processing liquid, the vessel having an entrance portion positioned to receive the processing liquid, the vessel further having an exit portion positioned to pass the processing liquid exiting the vessel, the vessel having a thermally transmissive vessel wall configured to transfer heat between a first region external to the vessel and a second region internal to the vessel;
• a heat transfer device positioned in the first region, the heat transfer device being thermally coupled to the vessel wall to transfer heat to or from the vessel wall;
• and
• a diffuser positioned in fluid communication with the vessel, the diffuser including a diffuser body having at least one entrance port, a plenum region in fluid communication with the at least one entrance port, a primary exit port disposed annularly inwardly from the plenum region, at least one primary flow passage coupled between the plenum region and the primary exit port, at least one secondary exit port disposed annularly outwardly from the primary exit port, and at least one secondary flow passage coupled between the plenum region and the at least one secondary exit port, the at least one secondary exit port being smaller than the primary exit port.