Method and system for cooling electronic components
AssigneeSun Microsystems, Inc.
InventorsShlomo Novotny, Arthur S. Rousmaniere, Marlin Vogel
Life of this patent
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Abstract
A system and method for cooling electronic components. The system includes a surface. One or more electronic components are coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink. A blower is coupled to the surface, the blower having a first port, a second port, and an impeller that rotates around an axis. The blower is oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower moves air across the heat sink.
Claims36
A system for cooling electronic components, the system comprising:
- a surface;
- one or more electronic components coupled to the surface;
- a blower coupled to the surface, the blower having a first port, a second port, and an impeller which rotates around an axis perpendicular to the surface, the first port aligned with the axis of impeller rotation and disposed above and spaced from the surface, the blower oriented such that air flowing into the first port flows through a channel formed by the blower and the surface, and perpendicular to the axis of impeller rotation
- a shroud defining an interior cavity and attachable to the surface so as to form an airflow path between the shroud and the second port when attached, the interior cavity having a first end sized to receive a heat sink therein and a second end sized substantially the same as the second port.
A system for cooling electronic components, the system comprising:
- a surface;
- one or more electronic components coupled to the surface;
- and
- a blower coupled to the surface, the blower having a first port, a second port, and an impeller which rotates around an axis perpendicular to the surface, the blower oriented such that the first port is spaced from and located above at least one of the one or more electronic components and is aligned with the axis, wherein air flowing through the first port flows directly across the at least one of the one or more electronic components perpendicular to the axis of impeller rotation.
A system for cooling electronic components, the system comprising:
- a surface;
- one or more electronic components coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink;
- a blower directly mounted to the surface, the blower having a first port spaced from and disposed above the surface, a second port arranged generally perpendicular to the first port, and an impeller which rotates around an axis perpendicular to the surface, wherein the blower is arranged proximate the heat sink wherein air flowing through the first port flows directly across the at least one of the one or more electronic components and perpendicular to the axis of impeller rotation.
A system for cooling electronic components, the system comprising:
- a surface;
- one or more electronic components coupled to the surface, the one or more electronic components including an integrated circuit in contact with a heat sink;
- a blower directly mounted to the surface, the blower having a first port, a second port, and an impeller which rotates around an axis, the blower oriented such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein the blower is wherein the blower moves air across the heat sink and perpendicular to the axis of impeller rotation;
- and
- wherein the blower is oriented such that the first port is spaced from and faces the surface so that air flowing across the first port flows between the blower and the surface.
A method for cooling one or more electronic components attached to a surface, the method comprising:
- generating airflow across a heat sink using a blower, the heat sink coupled to an integrated circuit coupled to the surface, the blower having a first port which is spaced from and disposed above the surface, a second port, and an impeller which rotates around an axis, the blower coupled to the surface such that the axis is perpendicular to the surface and non-intersecting with the heat sink, wherein air flowing through the first port flows directly across the heat sink and perpendicular to the axis of impeller rotation and air flowing through the second port is generally parallel with the axis of impeller rotation.
Dependencies are inferred from the claim text.