Semiconductor based air conditioning device
OwnerChuan-Sheng Cheninventor
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OwnerChuan-Sheng Cheninventor
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The present invention mainly utilizes a specialized semiconductor ship, the so-called thermoelectric cooling chip, for producing the coldness. A cooling circulating member and a heat dissipating member are configured at the two sides of the thermoelectric cooling chip. The coldness produced by the thermoelectric cooling chip is delivered by a cold conduction plate and cooling pipes, and is stored in fins of the cooling circulating member. A temperature controller determines a desired temperature and the coldness stored in the fins are blown out as cool air by a fan. Similarly, the heat produced by the chip is dissipated by the heat dissipating member. As such, the present invention could reach the desired temperature within a short period of time without the conventional compressor. The present invention therefore is easier to install and transport, consumes less power, and produces almost no noise and pollution to the environment.
A semiconductor-based air conditioning device comprising
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