Method for assembling micro-components to binding sites

A method for assembling micro-components to binding sites on a support having a pattern of electrical conductors adapted to conduct electrical energy between binding sites;

• the method comprising the steps of:
• passing an electrical signal through a first pattern of conductive pathways including at least one of the conductors so that a first pattern of heat is generated by the conductive pathways proximate to a first pattern of selected binding sites;
• applying, to the support, a first fluid that is adapted to increase in viscosity when heated;
• applying, to the support, a carrier fluid having first micro-components adapted to engage the binding sites;
• removing, from the support, the carrier fluid, the first fluid and any of the first micro-components not engaged to a binding site;
• passing a second electrical signal through a second pattern of conductive pathways that includes at least one of the conductors and that is different from the first pattern so a second pattern of heat is generated by the conductive pathways proximate to and a second pattern of selected binding sites;
• applying, to the support, a second fluid that is adapted to increase in viscosity when heated;
• and
• applying, to the support, a second carrier fluid having second micro-components adapted to engage the binding sites;
• wherein the first pattern of heat from the conductive pathways increases the viscosity of the first fluid proximate to the first pattern of selected binding sites so as to inhibit first micro-components from engaging the first pattern of selected binding sites;
• and
• wherein the second pattern of heat from the conductive pathways increases the viscosity of the second fluid proximate to the second pattern of selected binding sites so as to inhibit second micro-components from engaging the second pattern of selected binding sites.