Method and apparatus for defining leading edge taper of a write pole tip
AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorsQuang Le, Jui-Lung Li, Yvette Chung Nga Winton, Sue Siyang Zhang, Yi Zheng
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Abstract
A method and apparatus for defining leading edge taper of a write pole tip is disclosed. The fabrication process uses reactive ion etching to fabricate LET with tight control of the placement of LET's edge and to achieve higher angle for providing a higher effective write field at the pole tip while minimizing ATI for high-density perpendicular recording. The placement of a resist's edge is used to define the LET's edge and a CMP process is used to provide a planar surface for the fabrication of the write pole.
Claims11
A method for defining leading edge taper of a write pole, comprising:
- forming a flux guide recessed a predetermined amount from an air bearing surface;
- depositing a reactive ion etch sacrificial layer and CMP stop layer;
- lithographically patterning a single layer resist structure;
- using reactive ion etching to etch the CMP stop layer and taper the unexposed reactive ion etch sacrificial layer with a desired angle;
- depositing high magnetic induction material over the tapered reactive ion etch sacrificial layer, wherein the desired angle of the reactive ion etch sacrificial layer defines a leading edge taper edge;
- and
- performing chemical mechanical polishing to planarize and remove excess high magnetic induction material and stop chemical mechanical polishing on the CMP stop layer to provide a planar surface for the fabrication of the write pole.
Dependencies are inferred from the claim text.