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US 7,251,873 B2Granted
Method of manufacturing surface acoustic wave device
AssigneeFujitsu Media Devices Limited
InventorsAkira Suga, Masanori Ueda
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Abstract
Disclosed is a method of manufacturing a surface acoustic wave device comprising the steps of forming a drive electrode having a surface acoustic wave element function on a piezoelectric substrate wafer, providing a resist coat on an upper region of the drive electrode, covering the resist coat with a metal film, removing the resist coat lying within the metal film so that the metal film is formed in a dome form having a hollow portion covering the drive electrode, and providing a resin seal on the metal film.
Claims4
A method of manufacturing a surface acoustic wave device, comprising the steps of:
- forming a drive electrode having a surface acoustic wave element function and an external connection unit on a piezoelectric substrate wafer;
- providing a resist coat on an upper region of the drive electrode;
- covering the resist coat with a metal film;
- providing an electro-conductive column on the external connection unit;
- removing the resist coat lying within the metal film so that the metal film is formed in a dome form having a hollow portion covering the drive electrode;
- forming an external connection terminal at an extremity of the electro-conductive column;
- and
- providing a resin seal on the metal film.
5 more elements
Dependencies are inferred from the claim text.