High speed bus with radio frequency microstrip
AssigneeGateway, Inc.
InventorTze-Chuen Toh
Life of this patent
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Abstract
A method for preparing a printed circuit board and an apparatus are provided to decrease losses associated with high speed signal propagation. The printed circuit board has at least two conductive layers separated by an dielectric layer formed of a dielectric material. A conductive path is formed in one of the conductive layers for propagation of the high speed signal. At least a portion of the dielectric layer is removed on both sides of and adjacent to the conductive path. The removed portion extends in the dielectric layer between the conductive layers from one to the other and includes a hole shaped portion and a trough shaped portion. The removed portion does not extend beyond the dielectric layer.
Claims14
A method for preparing a printed circuit board to decrease losses associated with a propagation of a high speed signal thereon, the printed circuit board having at least two conductive layers, separated by a dielectric layer formed of a material having a dielectric value, the at least two conductive layers and the dielectric layer being arranged in respective parallel planes, the method comprising:
- forming at least one conductive path for the propagation of the high speed signal in at least one of the at least two conductive layers;
- and removing at least one portion of the dielectric layer on both sides of and adjacent to the at least one conductive path, the at least one portion so removed extending in the dielectric layer between the at least two conductive layers from the at least one of the at least two conductive layers to the other of the at least two conductive layers.
An apparatus for decreasing losses associated with a propagation of a high speed signal on a printed circuit board having at least two conductive layers, separated by a dielectric layer, the printed circuit board formed of a material having a dielectric value, the at least two conductive layers and the dielectric layer arranged in respective parallel planes, the apparatus comprising:
- at least one conductive path formed in at least one of the at least two conductive layers;
- and a removed portion of the dielectric layer, the removed portion being located on both sides of and adjacent to the at least one conductive path, and the removed portion extending in the dielectric layer between the at least two conductive layers from the at least one of the at least two conductive layers to the other of the at least two conductive layers.
Dependencies are inferred from the claim text.