System and method for reducing temperature variation during burn in
AssigneeTransmeta Corporation
InventorsEric Chen-Li Sheng, David H. Hoffman, John Laurence Niven
Life of this patent
Estimating the term…
Abstract
Systems and methods for reducing temperature variation during burn-in testing. In one embodiment, power consumed by an integrated circuit under test is measured. An ambient temperature associated with the integrated circuit is measured. A desired junction temperature of the integrated circuit is achieved by adjusting a body bias voltage of the integrated circuit. By controlling temperature of individual integrated circuits, temperature variation during burn-in testing can be reduced.
Claims29
A computer-implemented method of reducing temperature variation among integrated circuits during burn-in testing, said method comprising:
- measuring power consumed by an integrated circuit under test;
- measuring an ambient temperature associated with said integrated circuit under test;
- and
- adjusting a body bias voltage of said integrated circuit under test to achieve a desired junction temperature of said integrated circuit under test.
A computer-implemented method of reducing temperature variation among integrated circuits during burn-in testing, said method comprising:
- accessing a measurement of power consumed by an integrated circuit under test;
- accessing a measurement of an ambient temperature associated with said integrated circuit under test;
- and
- adjusting a body bias voltage of said integrated circuit under test to achieve a desired junction temperature of said integrated circuit under test.
A system for testing an integrated circuit comprising:
- an operating voltage supply for coupling said integrated circuit;
- a current measuring device for coupling said integrated circuit for measuring operating current of said integrated circuit;
- a body bias voltage supply for coupling said integrated circuit for providing a body bias voltage;
- an ambient temperature sensor for determining an ambient temperature for a region proximate to said integrated circuit;
- a test controller for coupling said integrated circuit and coupling said current measuring device, said bias voltage supply and said ambient temperature sensor, said test controller for implementing a method for reducing temperature variation among an integrated circuit during burn-in testing, said method comprising:
- accessing a measure of power consumed by said integrated circuit;
- accessing a measure of ambient temperature associated with said integrated circuit;
- and
- adjusting said body bias voltage of said integrated circuit to achieve a desired junction temperature of said integrated circuit.
A computer usable media comprising computer usable instructions which when executed on a processor implement a method for reducing temperature variation among integrated circuits during burn-in testing, said method comprising:
- measuring power consumed by said integrated circuit under test;
- measuring an ambient temperature associated with said integrated circuit;
- and
- adjusting said body bias voltage of said integrated circuit to achieve a desired junction temperature of said integrated circuit.
Dependencies are inferred from the claim text.