High power density insulated metal substrate based power converter assembly with very low BUS impedance

An electrical power circuit assembly, apparatus and method comprising;

• an insulated metal substrate (IMS) printed circuit board (PCB) assembly, designated IMS PCB, further comprising a metal substrate, one or more electrically insulating layers, one or more electrically conductive circuit foil layers and a plurality of semiconductor power devices soldered to said conductive circuit foil layers, a second PCB assembly, designated filter PCB, further comprising, one or more electrically non-conductive board layers, one or more electrically conductive circuit foil layers and one or more capacitors, one or more, electrically conductive bus bars located between said IMS PCB and said filter PCB, where the bus bar minor dimension is between said PCBs and the major dimension runs perpendicular to the electrical current flow in said semiconductor power devices or where any other bus bar geometry is used that substantially serves to minimize the inductance between said semiconductor power devices on the IMS PCB and said capacitors on the filter PCB, a rigid heatsink or a heat removal surface, a clamping mechanism.