Module with built-in circuit component and method for producing the same

A module with a built-in circuit component, comprising:

• an electric insulating layer;
• a pair of wiring layers provided on both principal planes of the electric insulating layer;
• a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof;
• a circuit component buried in the electric insulating layer;
• and
• a pair of wiring boards disposed so as to sandwich the electric insulating layer,
• wherein one of the pair of wiring layers provided on both principal planes of the electric insulating layer functions as a wiring layer for one of the wiring boards, and the other wiring layer functions as a wiring layer for the other wiring board,
• the plurality of via conductors are disposed at least on a part of a circumference of the electric insulating layer in accordance with a predetermined rule,
• a coefficient of linear thermal expansion of the wiring boards in a direction orthogonal to a thickness direction thereof is smaller than that of the electric insulating layer in a direction orthogonal to a thickness direction thereof, and
• a Young's modulus of the wiring boards is larger than that of the electric insulating layer.