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US 7,248,478 B2Granted
Coolant cooled type semiconductor device
AssigneeDenso Corporation
InventorSeiji Inoue
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a cooling unit in which coolant flows, a semiconductor chip having two main surfaces press-pinched by the cooling unit, and an electronic member different from the semiconductor chip. The electronic member is located to contact the cooling unit.
Claims5
A semiconductor device comprising:
- a cooling unit in which coolant flows;
- a semiconductor chip having two main surfaces press-pinched by the cooling unit;
- and
- an electronic member different from the semiconductor chip, wherein
- the electronic member is located to contact the cooling unit;
- the cooling unit includes a plurality of tubes;
- the semiconductor chip is located between adjacent two tubes;
- and
- the two main surfaces of the semiconductor chip contact the tubes.
6 more elements
A semiconductor device comprising:
- a cooling unit in which coolant flows;
- a semiconductor chip having two main surfaces press-pinched by the cooling unit;
- and
- an electronic member different from the semiconductor chip, wherein
- the electronic member is located to contact the cooling unit;
- the cooling unit includes a plurality of tubes, and a pair of header tanks connected to the tubes at two ends of each tube to communicate with the tubes;
- the semiconductor chip is press-pinched by the two tubes of the cooling unit;
- and
- the electronic member contacts one of the header tanks.
6 more elements
Dependencies are inferred from the claim text.