Apparatus for air cooling of an electronic device
AssigneeApple Inc.
InventorsSteven Holmes, Douglas L. Heirich
Life of this patent
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Abstract
An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.
Claims14
A contoured panel for directing a flow of air within an electronic device, comprising:
- a panel configured to be removably placed proximate to an electronic device, the electronic device having a heat producing element and a fan, said heat producing element being located within a first thermal zone within said electronic device, the panel further having a contoured portion configured to be placed proximate to the fan so as to direct a flow of air from the fan across the heat producing element, the flow of air facilitating the cooling of the heat producing element, wherein said contoured portion is further configured to reduce the volume of said first thermal zone.
An air-cooled electronic device, comprising:
- a housing;
- a microprocessor and a fan within the housing;
- a first thermal zone, said microprocessor being located therewithin, and
- a panel configured to be removably placed proximate to the housing, the panel having a contoured portion configured to direct a flow of air from the fan across the microprocessor so as to cool the microprocessor, wherein said contoured portion is further configured to reduce the volume of said first thermal zone.
An electronic device housing for an electronic device having a first internal thermal zone, comprising:
- a first portion configured to support a microprocessor;
- a second portion configured to support a first fan;
- a removable, contoured portion configured to direct air from the first fan across the microprocessor, so as to cool the microprocessor, wherein said removable contoured portion is further configured to reduce the volume of said first internal thermal zone.
A computer, comprising:
- a housing divided into a plurality of discrete thermal zones, each thermal zone compartmentalizing a heat producing element;
- a fan disposed inside each of the thermal zones and configured to force air over the heat producing element;
- a removable duct door having one or more contoured portions, the contoured portions protruding into at least one thermal zone so as to force air over the heat producing element located therein.
Dependencies are inferred from the claim text.