Method for manufacturing surface acoustic wave device
AssigneeKYOCERA Corporation
InventorsWataru Koga, Kiyohiro Iioka, Mitsutaka Shimada, Shinichiro Kitanishi
Life of this patent
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Abstract
A plurality of surface acoustic wave elements, with an IDT electrode 2 and a pad electrode 3 formed on the principal surface of a piezoelectric substrate 1, are formed to be flip-chip mounted on a circuit board 5 and sealed using sealing resin 7. The circuit board 5 is diced integrally with the sealing resin 7 applying a rotating dicing blade 8 from the bottom surface side thereof to produce a plurality of surface acoustic wave devices. The side surfaces of the surface acoustic wave devices can be formed perpendicularly with dimensional accuracy without rounding or chipping an edge portion of the sealing resin 7.
Claims9
A method for manufacturing a surface acoustic wave device comprising the steps of:
- (a) providing a circuit board with a connecting electrode formed thereon for each of a plurality of element mounting areas and the same number of piezoelectric substrates as that of the plurality of element mounting areas;
- (b) forming an IDT electrode and a pad electrode connected thereto in an area on the principal surface of each piezoelectric substrate corresponding to each element mounting area;
- (c) mounting a plurality of surface acoustic wave elements on the respective element mounting areas on the circuit board by bonding the pad electrode formed on each piezoelectric substrate to the connecting electrode formed on the upper surface of the circuit board;
- (d) applying sealing resin to the plurality of surface acoustic wave elements from the surface opposite the principal surface of the piezoelectric substrates over the upper surface of the circuit board;
- and
- (e) dicing the circuit board from the bottom surface side thereof to separate the plurality of surface acoustic wave elements into a plurality of surface acoustic wave devices.
Dependencies are inferred from the claim text.