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US 7,248,131 B2Granted
Monolithic vertical integration of an acoustic resonator and electronic circuitry
AssigneeAvago Technologies Wireless IP (Singapore) Pte. Ltd.
InventorsR. Shane Fazzio, Thomas E. Dungan
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Abstract
Monolithic devices that include an acoustic resonator vertically integrated with electronic circuitry are described. In one aspect, a monolithic integrated device includes a substrate, electronic circuitry supported by the substrate, an acoustic isolator over the electronic circuitry, and an acoustic resonator on the acoustic isolator. A method of fabricating the monolithic device also is described.
Claims18
A monolithic integrated device, comprising:
- a semiconductor substrate;
- electronic circuitry comprising at least one transistor that is supported by the substrate and has an electrical contact;
- an isolation structure comprising an acoustic isolator, electrically insulating material on the electronic circuitry, and a via extending from the electrical contact through the electrically insulating material;
- an acoustic resonator supported by the isolation structure over the acoustic isolator, wherein the acoustic resonator comprises a piezoelectric structure between first and second electrodes;
- and
- an electrically conductive path extending through the via and electrically connecting the electronic circuitry to one of the first and second electrodes of the acoustic resonator.
3 more elements
A method of fabricating a monolithic integrated device, comprising:
- forming electronic circuitry on a semiconductor substrate, wherein the electronic circuitry comprises at least one transistor that is supported by the substrate and has an electrical contact;
- forming an isolation structure over the electronic circuitry, wherein the isolation structure comprises an acoustic isolator, electrically insulating material on the electronic circuitry, and a via extending from the electrical contact through the electrically insulating material;
- forming an acoustic resonator supported by the isolation structure over the acoustic isolator, wherein the acoustic resonator comprises a piezoelectric structure between first and second electrodes;
- and
- forming an electrically conductive path extending through the via and electrically connecting the electronic circuitry to one of the first and second electrodes of the acoustic resonator.
2 more elements
Dependencies are inferred from the claim text.