Chip carrier with oxidation protection layer
AssigneeVIA Technologies, Inc.
InventorsKwun-Yao Ho, Moriss Kung
Life of this patent
Estimating the term…
Abstract
A chip carrier comprising a laminated layer and an oxidation protection layer is provided. The oxidation protection layer is a non-electrolytic metallic coating or an organic oxidation protection film on the surface of bonding finger pads or other contacts formed by deploying a simple, fast film-coating technique. Therefore, there is no need to plate a Ni/Au layer on the bonding pads or contacts using expensive electroplating equipment for preventing oxidation and there is no need to fabricate plating lines on the chip carrier or reserve space for laying out the plating lines. Thus, the cost for fabricating the chip carrier is reduced, the effective area of the chip carrier is increased and the electrical performance of the chip carrier is improved.
Claims13
A chip carrier for supporting a chip, comprising:
- a laminated layer having a non-plating line design, a top surface and a bottom surface, wherein the laminated layer has at least a bonding finger pad on the top surface and the bonding finger pad is electrically connected to the chip through a bonding wire;
- and
- an oxidation protection layer covering the bonding finger pad, wherein the oxidation protection layer is a non-electrolytic metallic coating, and wherein the oxidation protection layer has a thickness smaller than or equal to 0.5 μm, and the material constituting the oxidation protection layer is selected from a group consisting of cobalt, zinc, tin, and bismuth;
- and
- wherein the bonding wire penetrates the oxidation protection layer and directly connects the bonding finger pad.
A chip package structure, comprising:
- a chip;
- a chip carrier for supporting the chip and electrically connecting to the chip, having:
- a laminated layer having a non-plating line design, a top surface and a bottom surface, wherein the laminated layer has at least a bonding finger pad on the top surface, wherein the bonding finger pad comprises a copper pad or an aluminum pad;
- an oxidation protection layer covering the bonding finger pad, wherein the oxidation protection layer is a non-electrolytic metallic coating, and the material constituting the oxidation protection layer is selected from a group consisting of cobalt, zinc, tin, and bismuth;
- and at least a bonding wire connecting the chip and the bonding finger pad, wherein the bonding wire penetrates the oxidation protection layer and directly connects the bonding finger pad.
A chip package structure, comprising:
- a chip;
- a chip carrier for supporting the chip and electrically connecting to the chip, having:
- a laminated layer having a non-plating line design, a top surface and a bottom surface, wherein the laminated layer has at least a bonding finger pad on the top surface, wherein the bonding finger pad comprises a copper pad or an aluminum pad;
- an oxidation protection layer covering the bonding finger pad, wherein the oxidation protection layer is an organic oxidation protection film;
- and
- at least a bonding wire connecting the chip and the bonding finger pad, wherein the bonding wire penetrates the oxidation protection layer and directly connects the bonding finger pad.
Dependencies are inferred from the claim text.