Semiconductor device with stacked chips

A semiconductor device, comprising:

• a first semiconductor chip having a first surface with a first region and a second region, the chip additionally having a first circuit formed in the first region and a first electrode on the first region that is electrically connected to the first circuit, the first semiconductor chip further having a second electrode on the second region, the second electrode being electrically connected to the first electrode;
• a second semiconductor chip that is smaller than the first chip, the second chip having a second surface where a second circuit is formed and having a third electrode that is electrically connected to the second circuit, the second chip being stacked on the first chip and the third electrode being electrically connected to the first electrode;
• resin disposed between the first and second chips and on the first chip in a region not covered by the second chip, the resin disposed in the region not covered by the second chip having a surface lying substantially in a plane that passes between the first and second chips,
• wherein the resin disposed between the first and second chips has a thickness that is the same as the distance between the first and second chips so as to fill a space between the first and second chips;
• wherein the second electrode has an end surface that is exposed by the resin disposed in the region not covered by the second chip and that lies substantially in the plane, and
• wherein a protruding electrode is attached to the end surface of the second electrode that is exposed by the resin disposed in the region not covered by the second chip.