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US 7,247,944 B2Granted
Connector assembly
AssigneeMicron Technology, Inc.
InventorTrung T. Doan
Life of this patent
Estimating the term…
Abstract
An apparatus and method for attaching a semiconductor die to a lead frame wherein the electric contact points of the semiconductor die are relocated to the periphery of the semiconductor die through a plurality of conductive traces. A plurality of leads extends from the lead frame over the conductive traces proximate the semiconductor die periphery and directly attaches to and makes electrical contact with the conductive traces in a LOC arrangement. Alternatively, a connector may contact a portion of the conductive trace to make contact therewith.
Claims10
An assembly comprising:
- a semiconductor die having a periphery and an active surface having at least one electric contact;
- at least one conductive trace on the active surface, the at least one conductive trace comprising a first end electrically contacting the at least one electric contact of the semiconductor die and a second end terminating adjacent the periphery of the semiconductor die, the at least one conductive trace comprising a trace of extruded conductive material;
- and
- a connector connected to a portion of the at least one conductive trace.
1 more element
Dependencies are inferred from the claim text.