Integrated circuit with at least one bump

An integrated circuit, having a substrate and having a signal-processing circuit, which signal-processing circuit is produced in a region of the substrate adjoining a surface of the substrate and has a plurality of circuit elements and at least one first contact pad, wherein the first contact pad has a first boundary face accessible from outside the substrate and a second boundary face opposite from the first boundary face, wherein the first contact pad is intended for the electroconductive connection of a component contact of a circuit component external to the integrated circuit to the signal-processing circuit, and having a protective layer that is electrically insulating and provided on the surface of the substrate to protect the regions of the integrated circuit covered by said protective layer, wherein for each first contact pad an aperture in the protective layer is provided, wherein for each first contact pad a second contact pad is provided that is of a height of at least 15 μm and is intended for direct connection to a component contact and extends through the relevant aperture to the first contact pad and is electroconductively connected to the first contact pad and is seated on the protective layer by an overlap zone that projects laterally beyond the aperture and is closed on itself like a ring, wherein, along the whole of its ring-like extent, the overlap zone projects beyond the aperture laterally by substantially the same width of overlap, wherein the width of overlap is in a range of between 2 μm and 15 μm, and wherein at least one element of the signal-processing circuit is provided opposite the second boundary face of the first contact pad.